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Produktgruppen
07. – 09.05.2019 Nuremberg Tickets & registration

Product groups

At the SMTconnect, you’ll receive a comprehensive look at all the technical processes and systems involved in manufacturing electronic component assemblies.

  • Circuit development
    • ASIC design
    • PCB assembly/hardware design
    • Software development
    • Layout Designs
    • Circuit optimization
    • Hybrid circuit design
  • Functional testing
    • Electrical simulation service
    • Thermal simulation service
    • Thermo-mechanical simulation service
  • Audits
    • ESD auditing
  • Automated incoming goods inspection
    • Light microscopes
    • Magnifier lamps
  • Marking and labeling equipment
    • Labels
    • Label printer
    • Label application
    • Laser engraving
    • Barcode solutions
    • RFID solutions
  • Component loading
    • Component preparation equipment
    • Inertia-reel belts
    • Heat-sealing machines
    • Magazining units
    • Carrier/blister tapes
  • Material planning
  • Design
    • System design tools
    • Layout systems
    • Placement systems
    • CAD/CAM software
    • CAE/CAD tools
    • Components library
  • Simulation
    • Electrical simulation tools
    • Thermal simulation tools
    • Thermo-mechanical simulation tools
    • Logic simulators
    • ASIC simulators
  • Programming
    • Programming tools
    • In-circuit programmers
  • Functional testing
    • Test pattern generators
  • Research
    • R&D in materials for electronics
    • Technology R&D
      • R&D for wafer-level packaging
      • R&D in chip interconnects
      • R&D in substrate technologies/embedding
      • R&D in 3D circuit carriers
      • R&D in optical interconnects
      • R&D in encapsulation
    • R&D in reliability
    • R&D in system design
    • R&D in production automation
  • Consulting and training
  • Trend analysis
  • Publishers
  • Logic components
  • Mixed-signal components
  • Power components
  • Passive components
    • Capacitors
    • Coils
    • Resistors
    • Quartz oscillators
    • Fuses/fuse holders
    • Resonators
  • Switches and relays
    • Relays
    • Switches
    • Code switches
    • Other switches
  • Film circuits
    • Thick-film devices
    • Thin-film devices
    • Hybrid modules
  • Interconnection devices
    • Plugs
    • Sockets
    • Connectors
    • Contact elements
    • Coupler
  • Cable
  • Cable assembly
    • Insulation stripping tools and machines
    • Crimping machines
    • Cable assembly machines
    • Cable-harness sheating machines
    • Cable marking systems
  • Cable hardness assembly
    • Cable confection service
    • Cable hardness sheating service
    • Cable marking systems
    • Crimp services
  • Line sets
  • LED and displays
    • Display systems
    • LC displays and modules
    • Plasma displays
    • Touchscreen systems
    • Other displays
  • Batteries and holders
    • Batteries
    • Battery holders
  • Key boards and input devices
  • Dummy components
  • Housing
    • Enclosures for electronics
    • Sensor packages
    • Housing for microsystems
    • Thermal management packages
    • Hybrid housing
    • Ceramic packagings
    • Metal covers
    • Ball grid arrays
    • PAL, PLD, FPGA
    • Pin grid arrays
  • MID
  • Interposer
  • Smart cards
  • Thermal interface materials
  • Cooler
  • Fan/ventilator
  • Other components
  • Circuit carriers and substrate materials
    • Ceramic circuit carriers
      • Ceramic substrates and circuits
      • LTCC tape materials and circuits
      • Direct bonded copper substrates
    • FR4 circuit carriers
      • Resins
      • Laminates
      • Single- and multilayer substrates
      • PCBs with embedded components
      • Thick copper PCB
      • Heatsink PCB
    • Flexible circuit carriers
    • 3D circuit carriers
      • 3D MID
    • Circuit carrier for special purposes
      • High-temperature circuit boards
      • High-frequency circuit boards
      • High-current circuit boards
      • HDI circuit boards
      • Optical/electro-optical circuit boards
    • Other substrates
      • Alumnium circuit carriers
      • IMS substrates
      • Copper-laminated metal substrates
      • Photo-sensitive substrates
  • LTCC/HTCC processing equipment
    • Laser trimming
  • Polymer electronics
  • Mechanical processing of circuit carriers
    • Drilling and routing
      • Drilling and routing machines
      • Drills, routers
    • Depaneling machines
      • Scribing machines
      • Saws
      • Punching system and equipment
      • Plate shears, guillotine shears
      • Laser depaneling machines
    • Brushing machines
    • Multilayer presses
    • Laminators/rolling mills
  • Stucturing
    • Coating equipment
    • Plating equipment
    • Exposure and plotting
      • Photo plotters
      • Circuit board plotter
      • Development equipment
      • Stripping machines
      • Laser structuring
  • Metallization
  • Molding
    • Mold presses
    • Molding tools
    • Cutting/punching presses
    • Cutting/punching tools
    • Moulding compounds
    • Leadframes
  • Lasers
  • Hardness measurement devices
  • Viscosimeter
  • Microscope
  • Humidity
  • Wetting
  • Electrical resistance
  • Printing
    • Template and screen print
      • Template and screen printers
      • Templates and screens
      • Squeegees
      • Screen and template printing consumables
      • Cleaning screens and soldering frames
      • Self-mounting systems
      • Thick-film inks
      • Soldering pastes
      • Adhesives
    • Dispensing and mixing
      • Dispensing machines
      • Dispensing accessories
    • Encapsulants
      • Glob top materials
      • Potting materials
      • Underfiller
    • Conformal coating
      • Conformal coating systems
      • Conformal coating materials
    • Jetting
      • Inkjets
      • Paste jets
      • Solder paste jets
  • Adhesive bonding
    • Adhesives
    • SMD adhesives
    • Conductive adhesives
    • Die attach adhesives
  • Placement machines/assembly stations
    • Manual/semiautomatic SMT insertion machines
    • Fully automatic SMT insertion machines
    • 3D assembly equipment
    • Positioning systems
    • Special assembly stations
    • Assembly tools and benches
  • Soldering
    • Reflow soldering systems
    • Vapor-phase soldering systems
    • Wave soldering systems
    • IR soldering systems
    • Laser soldering systems
    • Selective soldering systems
    • Special soldering systems
      • Pulse soldering systems
      • Induction soldering systems
      • Plasma soldering systems
      • Spot soldering systems
    • Soldering irons
      • Hot-bar soldering systems
      • Light-beam soldering systems
      • Nitrogen hand-soldering stations
      • Wave hand-soldering systems
      • Hot-air soldering systems
    • Soldering materials
      • Solders
      • Soldering pastes
      • Solder preforms
      • Solder wires
      • Solder spheres
    • Fluxes
    • Soldering auxiliary equipment
      • Soldering masks
      • Soldering frames
      • Soldering aids
      • Solder tip cleaning equipment
      • Solder wire feeder
    • Solder recovery
    • Solder analysis
  • Welding
  • Hardening
    • UV gardening
    • IR gardening
    • Thermal hardening
    • Vacuum ovens
    • Hotplates
  • Bonding
    • Die bonders
    • Wire bonders
      • Wire bonding machines
      • Wire bonding tools
      • Bond wires
      • Ultrasonic generators
      • Ultrasonic transducer systems
  • Press-fit insertion technology
  • Mechanical connection technology
    • Clamping
    • Plugging
    • Crimping
  • Manual workstations
    • BGA/SMT rework systems
    • PCB track control and repair stations
  • Balling
    • Manual/semiautomatic balling systems
    • Fully automatic balling systems
  • Depaneling machines
  • Automation and handling equipment
    • Component loading equipment
    • Handling systems for chips
    • Handling and automatic-feed equipment
    • Machine linking and transport
    • Storage devices
    • Drives
      • Direct drives
      • Linear motors
      • Linear actuators
  • Clean room technologies
    • Clean room consumables
    • Clean room accessories
    • Flow boxes
  • Workplace furnishings
    • Assembly benches
    • Magnifiers
    • Lamps
  • ESD protection
    • Anti-static workstations
    • ESD  clothing
    • ESD  packaging, storage and shipping
    • Other ESD products
  • Storage
    • Dry storage systems
    • Storage systems under nitrogen atmosphere
    • Vacuum storage sytems
    • Cooling cabinets
    • Heated cabinets
  • Magazines and containers
    • Plastic magazines and containers
    • Metal magazines and containers
    • Vacuum boxes
  • Packaging
    • Carrier/blister tapes
    • Packaging material
    • Desiccants
    • Humidity indicator cards
  • Cleaning materials
    • Cleaning materials for stencils
    • PCB cleaning materials
    • Plastic cleaning materials
  • Cleaning and recycling systems
    • Plasma cleaning systems
    • Dry-ice jet cleaner
    • Other cleaning devices
    • Wastewater recycling equipment
    • Recycling equipment for precious metals
    • Filtration devices
    • Ionization devices
  • Environment and occupational safety
    • Solder recycling
    • Exhaust systems
    • Exhaust systems for solder fumes
    • Filters and filter materials
    • Solder fume absorbers
    • Gas purification and flux condensing units
    • Fan/ventilators
  • Product documentation
  • Electronic Manufacturing Services (EMS)
    • Assembly
      • SMD assembly
    • Surface pretreatment
    • Substrate plating
  • PCB manufacturing
    • Photoplotter service
  • Components provisioning
    • Taping and reeling
    • SMD Taping
    • Cutting, bending, forming
    • Sorting
  • Wafer-level packaging
    • Wafer thinning
    • Wafer-level redistribution
    • Wafer bumping
    • Chip size packaging (CSP)
    • Semiconductor interconnections
    • Semiconductor housing
  • Panel-level packaging
  • Chip-on-board assembly
    • Chip-on-flex assembly
    • Flip-chip assembly
    • Chip-on-glass assembly
  • Film circuits
    • Thick-film hybrids
    • Thin-film circuits
  • Laser machining
    • Laser drilling
    • Laser cutting
    • Laser trimming
  • Encapsulation
    • Molding
    • Potting
    • Glob top
    • Dam and Fill
    • Hermetic packaging
  • Cleaning
  • Assembly inspection and testing
    • Test houses
    • AOI Service
    • AXI Service
    • Test program development
  • Sample and small-batch production
  • Quality assurance and analysis
    • Release testing
    • Reliability consulting
    • Failure analysis
    • Calibration services
  • Repairs
  • Optical inspection stations
    • Automatic optical inspection (AOI)
      • Solder paste AOI
      • Assembly AOI
    • Manual optical inspection
      • Magnifier lamps
      • Microscopes
    • PCB inspection systems
    • Surface measuring system
      • Laser profilometers
      • Roughness measurement systems
      • Flatness measurement systems
    • Devices for measuring film thickness
  • Electrical inspection
    • Component testing equipment
    • Probe card analyzer, probes, probe cards
    • PCB testing equipment
    • Assembly testing equipment
    • In-circuit testing equipment and programs
    • Flying probe testing equipment
    • Function testing equipment
    • Insulation testing equipment
    • EMC testing equipment
    • High-frequency measurement equipment
    • Hot testing for PCB and hybrids
    • Test programs
    • Other test and balance systems
  • X-ray inspection
    • Computer tomography (CT)
    • Automatic X-ray inspection (AXI)
    • Manual X-ray inspection (MXI)
  • Ultrasonic inspection
    • Transducter testing systems
    • Acustic microscopes
  • Mechanical testing systems
    • Bonding testers
    • Adhesion testers
  • Chemical measurement systems
    • Contaminometers
    • Hygrometer
    • Oxygen analyzers
    • Other analytics/diagnostics equipment
  • Other inspection systems
    • Electroacoustic testing systems
    • Leakage testers
  • Burn-in systems
  • Cycle testing
  • Equipment accessories for assembly inspection
    • Test pins (spring-loaded)
    • Grinding machines
  • Process and equipment systems
    • Optical displacement measurement systems
    • Optical amplitude measurement systems for wire bonders
    • Bondability tester
    • Adhesion testers
    • Screen-tension measurement devices
    • Solderability testers
    • Control systems for soldering machines
    • Temperature profiler
    • Training and test kits
  • MES system
    • Production data acquisition systems
    • Machine data entry systems
  • Process and quality data mangement
  • Traceability systems
  • Software
  • RF transponder

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