Here you can find all current press releases about SMTconnect as well as the final report of the last event.
SMTconnect: Call for Papers opened for new Technology Days
Parallel to the SMTconnect exhibition, the new SMTconnect Technology Days will focus on mounting and connecting technologies in a wide variety of user sectors. Interested experts can submit their abstracts by 12 December 2018. The aim of the Technology Days is for specialists to pass on their knowledge in practice-oriented seminars and special sessions. Topics include soldering, substrate and adhesives technologies.
SMTconnect – New staging of electronic manufacturing services in the EMS Park
With the launch of the new exhibition area – the EMS Park, electronic manufacturing services will enjoy a new stage at the SMTconnect in 2019. Exhibitors will thereby benefit from a newly staged platform enabling an efficient exchange with their target groups; visitors will be able to locate further, tailor-made and individual solutions.
SMTconnect – Building on proven strengths: The event in a new look
SMT Hybrid Packaging becomes SMTconnect. As from 2019, the well-established event on electronic assemblies and systems will be held under a new name and feature diverse changes – based on its proven, solution-oriented concept.
SMT Hybrid Packaging 2018 – solution-oriented initiator
After an intensive three days, the SMT Hybrid Packaging event can look back at a successful exhibition and conference on system integration in microelectronics. 434 exhibitors presented their solutions on 26,400 m²; these reflected all the technical processes involved in the production of electronic assemblies.