Here you can find current press releases about SMTconnect as well as the final report of the last event.
SMTconnect 2019: Outlook on the event highlights
The SMTconnect, the only event in Europe that takes a holistic approach to system integration in microelectronics, offers participants a diverse program in Nuremberg from 7 - 9 May 2019.
SMTconnect Technology Days in Nuremberg features seminars on soldering and substrates
The new Technology Days at the SMTconnect, from 7 – 9 May 2019 in Nuremberg, is set to feature 35 top-class speakers, who will impart their expertise in practice-oriented lectures. Four seminars and four special sessions will be held in English and focus on two topics of assembly and joining techniques: soldering and substrates.
SMTconnect 2019 focuses on numerous innovations and proven formats
SMTconnect is set to take a holistic approach to microelectronic assemblies and systems - from development to production and service. In 2019, the event will not only be presenting itself under a new name, but will have even more developments to offer.
SMTconnect – New staging of electronic manufacturing services in the EMS Park
With the launch of the new exhibition area – the EMS Park, electronic manufacturing services will enjoy a new stage at the SMTconnect in 2019. Exhibitors will thereby benefit from a newly staged platform enabling an efficient exchange with their target groups; visitors will be able to locate further, tailor-made and individual solutions.
SMTconnect – Building on proven strengths: The event in a new look
SMT Hybrid Packaging becomes SMTconnect. As from 2019, the well-established event on electronic assemblies and systems will be held under a new name and feature diverse changes – based on its proven, solution-oriented concept.
SMT Hybrid Packaging 2018 – solution-oriented initiator
After an intensive three days, the SMT Hybrid Packaging event can look back at a successful exhibition and conference on system integration in microelectronics. 434 exhibitors presented their solutions on 26,400 m²; these reflected all the technical processes involved in the production of electronic assemblies.