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Mounting: Future-proof and efficient assembly
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Mounting

Future-proof and efficient assembly

In recent years, miniaturization, densification, functional enrichment, diversification and shortening of product lifecycles have accelerated for many electronic products, which also requires new concepts in SMT assembly.

As a result of these developments, production facilities need the flexibility and efficiency to enable the necessary innovations, changes and upgrades. As labor shortages and personnel costs are also worsening, further productivity improvements have been driven forward. These include the improvement of operating ratios and the reduction of labor requirements through factory automation by robotics, AI and IoT. As a result, production data traffic is increasing, and a new generation of placer platforms from Yamaha Motors is addressing this.

"Today it is essential that all manufacturing systems are well prepared for the demands of the age of fast and high-volume communication with accelerated data exchange," says Ryosuke Nakamura, Branch Manager Yamaha Motor Europe, IM Division.

Ryosuke Nakamura, Branch Manager

But many other aspects were also taken into account in the development of the modular premium placer YRM20 (available from April 2020). For example, a new approach was chosen for the placement head. It combines the rotary head of the Sigma series and the inline head of the YSM series. The resulting single-head solution can process all types of components, from ultra-small chips to large components, without changing the head. A newly developed rotary head, tailored to the next generation platform, works in conjunction with a durable new high-speed feeder with improved belt feed speed to achieve productivity up to 115,000 CPH. The YRM20 also features a new machine control system. It is ready to serve the new era of increasing data speed and volume requirements in production facilities. The new application software interacts seamlessly and securely with peripheral systems and external software.

To ensure the high-precision assembly of the smallest chip components, the new design of the X-beam reduces thermal distortion for high-precision assembly at ±25 μm (Cpk ≥ 1.0). This enables the machine to process miniature chip components of size 0201. The machine's new component recognition camera alternates between line and area images for flexible, faster and higher quality recognition. In addition, new ID-coupled nozzles offer fast, low-stress assembly due to reduced tip sliding movements. Maintenance is also more efficient than ever, as the nozzles operate with an automatic nozzle changer.

A newly developed transport system, which can handle a maximum PCB width of 510 mm, features an optimized layout and higher transport speeds, which significantly reduces the PCB changeover time and thus improves the effective production cycle. The machine also benefits from overdrive drive technology, which uses Sigma technology to ensure highly efficient production. Reducing the restrictions on placement head access when the front and rear sides of the table obstruct each other further increases actual productivity.

Contact

Oumayma Grad

Marketing Communications Manager SMT & FA Sections, Yamaha Motor Europe, IM Division

Frau Oumayma Grad

Related links

More information about Yamaha SMT Section:

www.yamaha-motor-im.de

Tags

  • Internet of Things (IoT)
  • Assembly
  • Automation
  • Miniaturization
  • Artificial Intelligence (AI)

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