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EMS
A Swiss pocketknife for EMS providers
Air pollution control and occupational safety
The "normal abnormal"
Semiconductor Technology
Chiplets - an approach to cost-optimized further IC-miniaturization for maximum performance of electronic systems
Module tests
Lightning-fast testing with electrical imaging reduces costs
Industry 4.0
For EMS manufacturers, digitalization and robotics are more than just technology
"Future Packaging" joint stand 2020
1.000 qm of component manufacturing converted from analog to digital
Professionals
"New Work" – is that really a goal-oriented working environment?
Soldering
"Dip and Look" versus solderability test
Assembly production
Balance between productivity and flexibility
Packaging and interconnection technology
Suitable for future development needs
Electronic components
First class into the future
Quality assurance
Testing power electronics in minutes instead of months
Optical inspection
What small and medium-sized pavers should be aware of
Soldering
Titanium covers – quality assurance right from the start
ESD packaging
ESD and environmental protection combined
Product Compliance
Trouble avoided
Rework
Effectively reworking ever smaller components
Ceramic materials
Ceramic high-performance wiring substrates
Soldering
From mechanically guided soldering to autonomous and a reproducible soldering process
After the game is before the game
A good trade fair appearance alone is not enough
Support systems
Support circuit boards efficiently and safely
Human research
Dominating the “war of talents”
Testing
Flying probe systems - what has to be considered?
Production line SMT
Electronics production: What solutions look like
Mounting
Closed control loops between SPI and printer do not only minimize errors
System integration
Energy efficiency is the driving force
Mounting
Future-proof and efficient assembly
Start-ups
That can get done faster!
Pick & Place
More efficient production of LED lighting assemblies
Obsolescence management
I’m off then
Incoming goods inspection
Reading labels safely
2nd Panel Level Packaging Consortium
Open for new partners and topics
Material flow
The main artery of SMD production
Flying Probe Tests
Double-sided test procedure for the optimal test strategy
Air humidification
The optimal climate ensures quality
Assembly
Industry 4.0 is not a Big Bang
Joining technology
Power modules sintering instead of soldering
Thermal management
Reliable processing of thermal conductive pastes
LGA devices
Minimize the voids in solder joints
Supply chain
Firmly establishing technical cleanliness
Reflow process
Real-time process control and traceability in reflow ovens
System integration
Integration is the key
Quality assurance
Industry 4.0 supports people
Cleaning systems, quality, miniaturization
Cleaning properly is worth the effort
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