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Facts and figures
07. – 09.05.2019 Nuremberg Tickets & registration

Facts and figures on SMTconnect

The SMTconnect brings together people and technologies from the areas of development, production, services, and applications in connection with electronic assemblies and systems. Here, you can learn more about the facts and figures on this event.

At a glance

This international exhibition, accompanied by a conference and tutorials, once again proved to be a must-attend event for its adjacent industry in 2018. A total of 434 exhibitors presented their solutions for electronic assemblies and systems to approximately 12,000 visitors.

Overall, the conference and tutorials recorded 203 attendees.

Event profile

Event profile

The SMTconnect offers a space for the expert community to gather and exchange ideas. The event strives to be a meeting place for all the areas involved in microelectronic production, including electronic manufacturing services (EMS). In doing so, the exhibition and conference focus on the following subjects:

  • System development and production preparation
  • Materials and components
  • Processes and manufacturing
  • Reliability and test
  • Software and production control

Application industries

Application industries

At the SMTconnect, you can interact with visitors from the following sectors:

  • Mechanical/apparatus engineering
  • Telecommunications
  • Medical technology
  • Aerospace engineering
  • Railway technology
  • Measurement technology
  • Industrial electronics
  • Safety engineering
  • Entertainment electronics
  • Household electronics
  • Automotive electronics
0180
Stefan Janssen, exhibitor FUJI EUROPE CORPORATION GmbH

I would actually claim that if you aren’t here, you aren’t very successful on the market.

Our past events have provided a great deal of information on solutions, developments, and ideas related to electronic assemblies and systems to experts from many well-known companies, including:

A
AB Electronic Devices
Adam Opel AG
AEG Power Solutions GmbH
Airbus Defence and Space GmbH
Alcatel Lucent Deutschland AG
Allied Visions Technologies GmbH
Audi AG


B

B. Braun Melsungen AG
Balluff GmbH
Basler AG
BCD Chemie GmbH
BMW AG
Bosch Rexroth AG
Bundesdruckerei Berlin GmbH


C

Carl Zeiss AG
CeramTec GmbH
Continental


D

Daimler AG
Danfoss Silicon Power GmbH
Deutsche Telekom AG
Diehl Metering GmbH

 

E  
E-T-A Elektrotechnische Apparate GmbH
Endress+Hausser GmbH & Co. KG
Euroimmun Medizinische Labordiagnostik AG


Festo AG & Co. KG
Fresenius Medical Care GmbH
Fronius International GmbH
Fujitsu Technology Solutions


G  

Grundig Business Systems GmbH


I
  

Infineon AG


L
  
Liebherr Elektronik GmbH


M
  
MAN Truck & Bus AG
MGV Stromversorgungen GmbH
Miele & Cie. KG


N
  
NIDEC MOTORS & ACTUATORS (GERMANY) GmbH


O

Osram GmbH


 
P&G
Pilz GmbH & Co. KG
Preh GmbH


R
  

Rohde & Schwarz GmbH & Co. KG


 
Semikron Elektronik GmbH & Co. KG
SEW Eurodrive GmbH & Co. KG
SICK AG
Siemens AG
STZ Signalverarbeitungssysteme


T  

TechniSat Digital GmbH
ThyssenKrupp System Engineering GmbH
TQ Systems GmbH
Turck Beierfeld GmbH


W

Würth Elektronik GmbH & Co. KG


Z

Zollner Elektronik AG Wroclaw University of Science and Technology

Chair
Prof. Dr. Klaus-Dieter Lang
, Fraunhofer IZM, Berlin

Members
Dr. Ellen Auerswald
, Fraunhofer ENASD

Dr. Hans Bell, Rehm Thermal Systems GmbH

Prof. Dr. Jörg Franke, Friedrich-Alexander-Universität Erlangen

Prof. Dr. Elmar Griese, Universität Siegen

Klaus Gross, FUJI EUROPE CORPORATION GmbH

Norbert Heilmann, ASM Assembly Systems GmbH & Co. KG

Jörg Hofmann, ifm datalink gmbh

Erik Jung, Fraunhofer IZM, Berlin

Dr. Jan Kostelnik, Würth Elektronik GmbH & Co. KG

Matthias Lorenz, AEMtec GmbH

Uwe Nacke, F & K Delvotec Bonding GmbH

Dr. Nils F. Nissen, Fraunhofer IZM, Berlin

Reinhard Pusch, RoodMicrotec GmbH

Prof. Dr. Marcus Reichenberger, Georg-Simon-Ohm-Hochschule, Nürnberg

Dr. Andreas Reinhardt, SEHO Systems GmbH

Dr. Franz Riedlberger, Glonn

Dr. Bernhard Ruf, VDI/VDE Innovation+Technik GmbH

Dr. Viktor Tiederle, RELNETyX AG

Jörg Trodler, Heraeus Materials Technology GmbH & Co. KG

Dr. Christian Ulzhöfer, SMT Maschinen- und Vertriebs GmbH & Co. KG

Prof. Dr. Thomas Zerna, Technische Universität Dresden

Take part in the SMTconnect now

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For visitors

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Conference and tutorials

Advance your knowledge in groundbreaking and practical fields.

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