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Facts and figures
05. – 07.05.2020 Nuremberg Tickets & registration

Facts and figures on SMTconnect

The SMTconnect brings together people and technologies from the areas of development, production, services, and applications in connection with electronic assemblies and systems. Here, you can learn more about the facts and figures on this event.

Event profile

Event profile

The SMTconnect offers a space for the expert community to gather and exchange ideas. The event strives to be a meeting place for all the areas involved in microelectronic production, including electronic manufacturing services (EMS).

In doing so, the exhibition focuses on the following subjects:

The Assembly and Interconnection Technologies (AVT) sector incorporates the full breadth of technology and design tools necessary for mounting microelectronic components onto the smallest of spaces. Furthermore, AVT allows for the linking of microelectronics and non-electronic microcomponents with full systems.

With the properties that they offer, materials and semi-finished goods provide an important foundation for the components and systems at a later stage. Components can hardly be seen by the naked eye and are getting ever smaller; however, the reduced need for space, a reduction in weight and greater concentration of the components are placing new demands on machines, materials and processing and placement technologies.

This area addresses, amongst others, the production of electronic assemblies using a range of different technologies. The omnipresence of electronic products in all areas of life has resulted in huge changes in production requirements. And this, in turn, is creating considerable challenges in the field of production technologies, for example, through the miniaturisation of components and the constant pressure to reduce costs.

Production quality is determined not least by the auxiliary equipment.  Appropriate storage, transport and the handling of materials, components and part products are important prerequisites for a stable production process.

Companies often have to face the commercial decision: “Do we make or do we buy?”
Having the right resources and staff available, as well as the quality of the product, play as much of a role in answering this question, as the financial considerations. Often external suppliers can produce a higher quality item much more cost-effectively. Companies also need partners with whom they can develop new products, as well as research and improve technologies.

It is almost impossible these days to find a device that doesn’t operate electronically. Electronics are therefore a critical factor in product functionality. In electronic assembly production, quality demands are at their highest.

There is a particular focus on Manufacturing Execution Systems (MES) in electronic production. The, in some cases, very high degree of automation necessitating far-reaching integration of MES within the facility is of particular interest. Alongside MES Systems, with the subcategories of business and machine data collection, even more product areas will be addressed at SMTconnect.

Application industries

Application industries

At the SMTconnect, you can interact with visitors from the following sectors:

  • Mechanical/apparatus engineering
  • Telecommunications
  • Medical technology
  • Aerospace engineering
  • Railway technology
  • Measurement technology
  • Industrial electronics
  • Safety engineering
  • Entertainment electronics
  • Household electronics
  • Automotive electronics
MK2_9341
Necdet Ozyonum, visitor C3 Teknoloji Bilisim Elektronik San. ve Tic. Ltd. Sti.

This show gets better every year. I strongly recommend every production engineer to visit this event, see the technological advancement with their own eyes and talk to the experts. In short: feel the whole electronic production there.

Our past events have provided a great deal of information on solutions, developments, and ideas related to electronic assemblies and systems to experts from many well-known companies, including:

A
AB Electronic Devices
Adam Opel AG
AEG Power Solutions GmbH
Airbus Defence and Space GmbH
Alcatel Lucent Deutschland AG
Allied Visions Technologies GmbH
Audi AG


B

B. Braun Melsungen AG
Balluff GmbH
Basler AG
BCD Chemie GmbH
BMW AG
Bosch Rexroth AG
Bundesdruckerei Berlin GmbH


C

Carl Zeiss AG
CeramTec GmbH
Continental


D

Daimler AG
Danfoss Silicon Power GmbH
Deutsche Telekom AG
Diehl Metering GmbH

 

E  
E-T-A Elektrotechnische Apparate GmbH
Endress+Hausser GmbH & Co. KG
Euroimmun Medizinische Labordiagnostik AG


Festo AG & Co. KG
Fresenius Medical Care GmbH
Fronius International GmbH
Fujitsu Technology Solutions


G  

Grundig Business Systems GmbH


I
  

Infineon AG


L
  
Liebherr Elektronik GmbH


M
  
MAN Truck & Bus AG
MGV Stromversorgungen GmbH
Miele & Cie. KG


N
  
NIDEC MOTORS & ACTUATORS (GERMANY) GmbH


O

Osram GmbH


 
P&G
Pilz GmbH & Co. KG
Preh GmbH


R
  

Rohde & Schwarz GmbH & Co. KG


 
Semikron Elektronik GmbH & Co. KG
SEW Eurodrive GmbH & Co. KG
SICK AG
Siemens AG
STZ Signalverarbeitungssysteme


T  

TechniSat Digital GmbH
ThyssenKrupp System Engineering GmbH
TQ Systems GmbH
Turck Beierfeld GmbH


W

Würth Elektronik GmbH & Co. KG


Z

Zollner Elektronik AG Wroclaw University of Science and Technology

Chair
Prof. Dr. Klaus-Dieter Lang
, Fraunhofer IZM, Berlin

Members
Dr. Ellen Auerswald
, Fraunhofer ENAS

Dr. Hans Bell, Rehm Thermal Systems GmbH

Prof. Dr. Jörg Franke, Friedrich-Alexander-Universität Erlangen

Prof. Dr. Elmar Griese, Universität Siegen

Klaus Gross, FUJI EUROPE CORPORATION GmbH

Jürgen Gruber, RoodMicrotec GmbH

Norbert Heilmann, ASM Assembly Systems GmbH & Co. KG

Jörg Hofmann, ifm datalink gmbh

Erik Jung, Fraunhofer IZM, Berlin

Dr. Jan Kostelnik, Würth Elektronik GmbH & Co. KG

Matthias Lorenz, AEMtec GmbH

Uwe Nacke, F & K Delvotec Bonding GmbH

Dr. Nils F. Nissen, Fraunhofer IZM, Berlin

Prof. Dr. Marcus Reichenberger, Georg-Simon-Ohm-Hochschule, Nürnberg

Dr. Andreas Reinhardt, SEHO Systems GmbH

Dr. Franz Riedlberger, Glonn

Dr. Viktor Tiederle, RELNETyX AG

Jörg Trodler, Heraeus Materials Technology GmbH & Co. KG

Dr. Christian Ulzhöfer, SMT Maschinen- und Vertriebs GmbH & Co. KG

Prof. Dr. Thomas Zerna, Technische Universität Dresden

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