Facts and figures
07. – 09.05.2019 Nuremberg Tickets & registration

Facts and figures on SMTconnect

The SMTconnect brings together people and technologies from the areas of development, production, services, and applications in connection with electronic assemblies and systems. Here, you can learn more about the facts and figures on this event.

At a glance

This international exhibition, accompanied by a conference and tutorials, once again proved to be a must-attend event for its adjacent industry in 2018. A total of 434 exhibitors presented their solutions for electronic assemblies and systems to 11,879 visitors.

Overall, the conference and tutorials recorded 203 attendees.

Learn more in the final report about SMT Hybrid Packaging.

SMT 2018 infographic

Event profile

Event profile

The SMTconnect offers a space for the expert community to gather and exchange ideas. The event strives to be a meeting place for all the areas involved in microelectronic production, including electronic manufacturing services (EMS). In doing so, the exhibition and conference focus on the following subjects:

  • System development and production preparation
  • Materials and components
  • Processes and manufacturing
  • Reliability and test
  • Software and production control

Event figures



434 exhibitors from 30 countries presented their products and services. The proportion of international exhibitors was 36%.
On an exhibition space of 26,400 sqm, exhibitors showcased individual solutions for all aspects of electronic assemblies and systems.
93% of these exhibitors are planning to participate again



The 11,879 visitors, 32% of which came from abroad, primarily represent the areas of production (25%), research and development (18%), design and technology (16%), management (16%) and sales (11%).
86% of visitors are involved in procurement decisions.
94% of exhibitors praised the quality of discussions with visitors

Speakers and participants

Speakers and participants

203 participants used the conference and (short) tutorials to find out further information on topics in electronics production.

Application industries

Application industries

At the SMTconnect, you can interact with visitors from the following sectors:

  • Mechanical/apparatus engineering
  • Telecommunications
  • Medical technology
  • Aerospace engineering
  • Railway technology
  • Measurement technology
  • Industrial electronics
  • Safety engineering
  • Entertainment electronics
  • Household electronics
  • Automotive electronics
Necdet Ozyonum, visitor C3 Teknoloji Bilisim Elektronik San. ve Tic. Ltd. Sti.

This show gets better every year. I strongly recommend every production engineer to visit this event, see the technological advancement with their own eyes and talk to the experts. In short: feel the whole electronic production there.

Our past events have provided a great deal of information on solutions, developments, and ideas related to electronic assemblies and systems to experts from many well-known companies, including:

AB Electronic Devices
Adam Opel AG
AEG Power Solutions GmbH
Airbus Defence and Space GmbH
Alcatel Lucent Deutschland AG
Allied Visions Technologies GmbH
Audi AG


B. Braun Melsungen AG
Balluff GmbH
Basler AG
BCD Chemie GmbH
Bosch Rexroth AG
Bundesdruckerei Berlin GmbH


Carl Zeiss AG
CeramTec GmbH


Daimler AG
Danfoss Silicon Power GmbH
Deutsche Telekom AG
Diehl Metering GmbH


E-T-A Elektrotechnische Apparate GmbH
Endress+Hausser GmbH & Co. KG
Euroimmun Medizinische Labordiagnostik AG

Festo AG & Co. KG
Fresenius Medical Care GmbH
Fronius International GmbH
Fujitsu Technology Solutions


Grundig Business Systems GmbH


Infineon AG

Liebherr Elektronik GmbH

MAN Truck & Bus AG
MGV Stromversorgungen GmbH
Miele & Cie. KG



Osram GmbH

Pilz GmbH & Co. KG
Preh GmbH


Rohde & Schwarz GmbH & Co. KG

Semikron Elektronik GmbH & Co. KG
SEW Eurodrive GmbH & Co. KG
Siemens AG
STZ Signalverarbeitungssysteme


TechniSat Digital GmbH
ThyssenKrupp System Engineering GmbH
TQ Systems GmbH
Turck Beierfeld GmbH


Würth Elektronik GmbH & Co. KG


Zollner Elektronik AG Wroclaw University of Science and Technology

Prof. Dr. Klaus-Dieter Lang
, Fraunhofer IZM, Berlin

Dr. Ellen Auerswald
, Fraunhofer ENASD

Dr. Hans Bell, Rehm Thermal Systems GmbH

Prof. Dr. Jörg Franke, Friedrich-Alexander-Universität Erlangen

Prof. Dr. Elmar Griese, Universität Siegen


Norbert Heilmann, ASM Assembly Systems GmbH & Co. KG

Jörg Hofmann, ifm datalink gmbh

Erik Jung, Fraunhofer IZM, Berlin

Dr. Jan Kostelnik, Würth Elektronik GmbH & Co. KG

Matthias Lorenz, AEMtec GmbH

Uwe Nacke, F & K Delvotec Bonding GmbH

Dr. Nils F. Nissen, Fraunhofer IZM, Berlin

Reinhard Pusch, RoodMicrotec GmbH

Prof. Dr. Marcus Reichenberger, Georg-Simon-Ohm-Hochschule, Nürnberg

Dr. Andreas Reinhardt, SEHO Systems GmbH

Dr. Franz Riedlberger, Glonn

Dr. Bernhard Ruf, VDI/VDE Innovation+Technik GmbH

Dr. Viktor Tiederle, RELNETyX AG

Jörg Trodler, Heraeus Materials Technology GmbH & Co. KG

Dr. Christian Ulzhöfer, SMT Maschinen- und Vertriebs GmbH & Co. KG

Prof. Dr. Thomas Zerna, Technische Universität Dresden

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