As a journalist, you can access a wide range of material here for reporting on SMTconnect.
Press releases on SMTconnect All press releases
SMT Hybrid Packaging 2018 – solution-oriented initiator
After an intensive three days, the SMT Hybrid Packaging event can look back at a successful exhibition and conference on system integration in microelectronics. 434 exhibitors presented their solutions on 26,400 m²; these reflected all the technical processes involved in the production of electronic assemblies.
Accreditation for the SMTconnect takes place directly on site at the press center. A pre-accreditation for visiting a Mesago event is not necessary.
You will find the press center in NCC Ost, Level 1. Modern technical conditions for your editorial coverage are also available for you.
- wireless lan connection in the press center area
- 6 PC workstations
- 4 laptop workstations and
- a printer on the workstations