Within the manufacturing process of electronic assemblies, automatic inspection systems can only classify a product as good/bad at a certain point in time. This assumes reliable operation for a certain period of time under defined operating conditions. However, this service life prediction is not based on real measured values of the respective assembly.
The SesiM research project is investigating ways to determine indicators of the reliability of electronic assemblies during the manufacturing process. In addition, the use of AI is being used to make service life predictions.
Speaker
Jens Kokott
GÖPEL electronic GmbH
Jens Kokott studied instrumentation and precision engineering at the Friedrich Schiller University in Jena and marketing and management at the University of Hagen in marketing and management. Since 1992 he has been working for GÖPEL electronic GmbH as a for automatic optical inspection systems and since 2016 he is responsible for the product management of the AOI systems since 2016.
Tags
- Industry 4.0
- Test and inspection solutions (AOI, AXI, ICT)
- Process and equipment systems