SMT Insights archive

SMT Insights: Talks – compact, digital, focused

Air pollution control and occupational safety

The "normal abnormal"

SMT Insights on air

Soldering on Lightweight Plastic: Sustainable Manufacturing of Innovative Product Concepts

Inline X-ray

3D AXI Process- and Audit-Proof in Manufacturing

Pick & Place

Feeder density within SMT and Electronic Assembly

mta MPS700 bottom side selective soldering machine with iron head technology allowing to access many difficult-to-reach joints.

The perfect complement or alternative to selective miniwave soldering

Extraction systems

Effectively protect employees and products

Almit's solder wire DB-1 RMA LFM-48 M

A new dimension of wettability through double boost

ESD

Special floors for safe electronics production

ZVEI-Traceability-Initiative

Implement traceability quickly and securely

EMS

Practical insight: future-proof investment in new production line

"Future Packaging" joint stand 2020

1.000 qm of component manufacturing converted from analog to digital

HyperCLEAN – the new multipurpose platform

Flying Probe Systems: a genuinely alternative compared to classical ICT.

The future of Flying Probe Technology

Double use of direct room air humidification

Quality assurance and health protection through air humidification

Connection technology

Reproducible hot caulking is also possible at low cost

ESD protection

ESD-packaging as tailor-made suit

Stencil inspection

How to avoid printing errors through stencil inspection

EMS

A Swiss pocketknife for EMS providers

Packaging and interconnection technology

Suitable for future development needs

Precision Equipment meets high-performance materials

3D Printing System for Multi-material Designs

Module tests

Lightning-fast testing with electrical imaging reduces costs

Solderstar to Launch a Unique Zero Set-Up Datalogger

Assembly production

Automated, pinpoint and reproducible soldering

ESD packaging

Solid board opens up new perspectives

Wirebonding

The right connection technology facilitates market entry for battery packs

Industry 4.0

For EMS manufacturers, digitalization and robotics are more than just technology

Soldering

Titanium covers – quality assurance right from the start

Job market

No improvement for the high-tech industries in sight

Soldering

"Dip and Look" versus solderability test

PCB Manufacturing

Caution sensitive circuit boards

Feeder

Mastering the tray variety

Assembly production

Balance between productivity and flexibility

Rework

Effectively reworking ever smaller components

Semiconductor Technology

Chiplets - an approach to cost-optimized further IC-miniaturization for maximum performance of electronic systems

Quality assurance

Testing power electronics in minutes instead of months

Depanelization

Printed circuit boards - better milled or lasered?

Humidifiers

Double benefit for electronics manufacturing

Optical inspection

What small and medium-sized pavers should be aware of

Soldering

From mechanically guided soldering to autonomous and a reproducible soldering process

Professionals

"New Work" – is that really a goal-oriented working environment?

Solder paste printing

Optimal accessories increase efficiency

Product Compliance

Trouble avoided

Support systems

Support circuit boards efficiently and safely

Electronic components

First class into the future

Testing

Flying probe systems - what has to be considered?

ESD packaging

ESD and environmental protection combined

Mounting

Closed control loops between SPI and printer do not only minimize errors

Ceramic materials

Ceramic high-performance wiring substrates

Mounting

Future-proof and efficient assembly

After the game is before the game

A good trade fair appearance alone is not enough

Pick & Place

More efficient production of LED lighting assemblies

Human research

Dominating the “war of talents”

Incoming goods inspection

Reading labels safely

Production line SMT

Electronics production: What solutions look like

2nd Panel Level Packaging Consortium

Open for new partners and topics

System integration

Energy efficiency is the driving force

Material flow

The main artery of SMD production

Start-ups

That can get done faster!

Flying Probe Tests

Double-sided test procedure for the optimal test strategy

Obsolescence management

I’m off then

Air humidification

The optimal climate ensures quality

Assembly

Industry 4.0 is not a Big Bang

Joining technology

Power modules sintering instead of soldering

Thermal management

Reliable processing of thermal conductive pastes

LGA devices

Minimize the voids in solder joints

Supply chain

Firmly establishing technical cleanliness

Reflow process

Real-time process control and traceability in reflow ovens

System integration

Integration is the key

Quality assurance

Industry 4.0 supports people

Cleaning systems, quality, miniaturization

Cleaning properly is worth the effort